1/3 data brief october 2004 VS6650 1.0 megapixel smia camera module rev. 1 features 1.0 megapixel resolution (1152h x 864v) smia 1 1.0 profile 1 compliant imager ccp 2.0 serial video interface two-wire control port (cci) on-chip pll based on 13 mhz system clock up to 30 frame per second (fps) progressive scan, with smooth frame rate control horizontal downscale from 1x to 4.5x in 1/16 steps operation from 2.4 v analog power supply low emi 1.8 v digital and i/o power supply 30 w power-down consumption 10-bit on-chip adc small size 1/3 inch lens fixed focus module integral emc shielding description the VS6650 is a 1.0 megapixel camera module for use across a range of mobile phone platforms. the camera module, which is smia 1.0 profile 1 compliant, can generate 1.0 megapixel images up to 30 fps. based on the smia architectural concepts, the VS6650 can be used with or without image pro- cessor (i.e. stv0976 or stv0984). the module is suitable for performance-driven camera phones and cost-driven high volume designs. the embed- ded horizontal scaler typically enables the realiza- tion of power-efficient viewfinder that uses host software processing. for performance driven ap- plications or when a different video interface is re- quired, the stv0976 mobile imaging processor ensures state-of-the-art image reconstruction and compression at up to 15 fps. the VS6650 features allow straightforward inte- gration into mobile phone designs: low emi video interface and package/socket shielding, low wire count (8 total), embedded power management (30 w power-down) and embedded pll. a minimal list of external components is required: supply de- coupling capacitors, cci pull-ups and a charge- pump capacitor. the VS6650 3-element lens design ensures high quality image capture while maintaining low mod- ule height. the overall optical stack, including lens system, ir filter and sensor optical structures is developed within st. the VS6650 package uses the second generation of smop2 packaging technology. sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. this 1.0 megapixel sensor fits within the smia95 form factor (9.5 x 9.5 x 7.6 mm 3 ). applications mobile phone pda wireless security camera table 1. order codes 1.standard mobile imaging architecture, visit www.smia-forum.org part number description VS6650s02f/t2 smop2 smia95 22? tape and reel
VS6650 2/3 figure 1. application diagram figure 2. block diagram figure 3. outline drawing table 2. technical specifications table 3. temprature range extclk xshutdown ccp 2.0 1.0 megapixel VS6650 smia camera module cci stv0976 1.0 megapixel mobile imaging processor (optional) baseband or application processor smia scl sda extclk xshutdown clkp clkn datap datan vana agnd vdig dgnd vcap 1152 x 864 y decoder 1160 x 872 column adc x decoder line sram readout ccp 2.0 transmitter smia profile 1 frame formatter cci receiver sensor control registers pll and clock management power mgmt power-on reset pixel array VS6650 active pixels 1152h x 864v pixel size 4.0 m x 4.0 m array size 4.640 mm x 3.488 mm color filter array rgb bayer exposure control +120 db analog gain +24 db (max) dynamic range 61 db (typical) signal-to-noise ratio 35 db at 100 lux frame rate 5 to 30 hz (1152h x 864v) pixel format raw bayer 10-bit raw bayer 8-bit compressed video interface ccp 2.0 high-speed serial 390 mbit/s d/s encoding 1.8 v lvds clock input 6 to 27 mhz square 13 mhz typ. (on-chip pll) supply voltage 2.4 to 2.9 v analog 1.8 v 0.1 v digital i/o voltage 1.8 v cmos levels power consumption streaming @ 15 fps: 85 mw max. power down: 15w max. lens 3-element 50 hfov f#3.2 depth of field 50 cm to infinite tv distortion < 1 % relative illumination 45 % (typical) package type smop2 smia 95 package size 9.5 x 9.5 x 7.6 mm 3 (wlh) system attach 16-pin smd socket with emc shield storage -40 to +85c functional -30 to +70c normal operating -25 to +55 c optimal operating +5 to +30c test 23 2c
3/3 VS6650 revision history table 4. revision history date revision description of changes october 2004 1 first issue information furnished is believed to be accurate and reliable. however, stmicroelectronics assumes no responsibility for the co nsequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. no license is granted by implication or otherwise under any patent or patent rights of stmicroelectronics. specifications mentioned in this publicati on are subject to change without notice. this publication supersedes and replaces all information previously supplied. stmicroelectronics prod ucts are not authorized for use as critical components in life support devic es or systems without express written approval of stmicroelectro nics. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners ? 2004 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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